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Thermal interface materials market to grow at CAGR 11.30% to 2021 according to new research report

Thermal interface materials market to grow at CAGR 11.30% to 2021 according to new research report

Global Thermal Interface Materials Market study conducted using an objective combination of primary and secondary information including inputs from key participants in the market during 2017-2021.

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Global Thermal Interface Materials Market report covers the present scenario and the growth prospects of the industry for 2017-2021. To calculate the market size, the report considers the revenue generated in terms of value for the market.

The analysts forecast global thermal interface materials (TIMs) market to grow at a CAGR of 11.30% during the period 2017-2021.

Thermal interface materials (TIMs) are used for dissipating excessive heat generated from a heat source in various equipment.

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They are generally used in the form of a secondary thermal conductive material to replace the thermally insulating air between the surfaces.

Report: www.reportsnreports.com/contacts/994451

 

Market driver
Advantages of TIM.

Market challenge
Ease of availability of alternative technologies.

Market trend
Advances in technology.

Report: www.reportsnreports.com/994451

Key vendors
The key players in the Thermal Interface Materials Market are Dow Corning, Henkel, Honeywell, Laird, Momentive.

Other Prominent Vendors

Other Prominent Vendors in the market are 3M, Akasa group, Indium Corporation, Parker Chomerics, Zalman.

 

The report, Global Thermal Interface Materials Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. This report covers the market landscape and its growth prospects over the coming years.

The report also includes a discussion of the key vendors operating in this market.

Complete Report Available at www.reportsnreports.com/reports/99…et-2017-2021.html

Table of Contents of the Report

PART 01: Executive summary

PART 02: Scope of the report

PART 03: Research Methodology

PART 04: Introduction
Key market highlights
Overview

PART 05: Market landscape
Market overview
Market size and forecast
Five forces analysis

PART 06: Market segmentation by application
Global TIMs market for computers
Global TIMs market for telecom
Global TIMs market for automotive electronics
Global TIMs market for medical devices
Global TIMs market for other applications

PART 07: Geographic segmentation
TIMs market in APAC
TIMs market in Americas
TIMs market in EMEA

PART 08: Key leading countries

PART 10: Drivers and challenges
Market drivers
Impact of drivers on key application segments
Market challenges
Impact of challenges on key application segments

PART 11: Market trends
Advances in technology
Increasing usage of PCTIMs
Growing commercial use of metal matrix composites and ceramic matrix composites

PART 12: Vendor landscape
Competitive scenario
Other prominent vendors

PART 14: Appendix
List of abbreviations

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