Global Thermal Interface Materials Market study conducted using an objective combination of primary and secondary information including inputs from key participants in the market during 2017-2021.
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Global Thermal Interface Materials Market report covers the present scenario and the growth prospects of the industry for 2017-2021. To calculate the market size, the report considers the revenue generated in terms of value for the market.
The analysts forecast global thermal interface materials (TIMs) market to grow at a CAGR of 11.30% during the period 2017-2021.
Thermal interface materials (TIMs) are used for dissipating excessive heat generated from a heat source in various equipment.
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Advantages of TIM.
Ease of availability of alternative technologies.
Advances in technology.
The key players in the Thermal Interface Materials Market are Dow Corning, Henkel, Honeywell, Laird, Momentive.
Other Prominent Vendors
Other Prominent Vendors in the market are 3M, Akasa group, Indium Corporation, Parker Chomerics, Zalman.
The report, Global Thermal Interface Materials Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. This report covers the market landscape and its growth prospects over the coming years.
The report also includes a discussion of the key vendors operating in this market.
Complete Report Available at www.reportsnreports.com/reports/99…et-2017-2021.html
Table of Contents of the Report
PART 01: Executive summary
PART 02: Scope of the report
PART 03: Research Methodology
PART 04: Introduction
Key market highlights
PART 05: Market landscape
Market size and forecast
Five forces analysis
PART 06: Market segmentation by application
Global TIMs market for computers
Global TIMs market for telecom
Global TIMs market for automotive electronics
Global TIMs market for medical devices
Global TIMs market for other applications
PART 07: Geographic segmentation
TIMs market in APAC
TIMs market in Americas
TIMs market in EMEA
PART 08: Key leading countries
PART 10: Drivers and challenges
Impact of drivers on key application segments
Impact of challenges on key application segments
PART 11: Market trends
Advances in technology
Increasing usage of PCTIMs
Growing commercial use of metal matrix composites and ceramic matrix composites
PART 12: Vendor landscape
Other prominent vendors
PART 14: Appendix
List of abbreviations
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