A dicing saw is a saw that is used to dice, groove, or cut semiconductor wafers by using a high-speed spindle that has been fitted with a diamond blade. A dicing saw is a part of a dicing machine, which cuts these wafers into individual chips.
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Global Wafer Dicing Saws market to grow at a CAGR of 6.35% during the period 2017-2021.
Some of the materials that can be diced using this machine are silicon, silicon carbide, gallium nitride, gallium arsenide, ceramic, sapphire, and glass.
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Dicing equipment can be categorized into three types, namely sawing equipment, scribing equipment, and sawing accessories. Sawing accessories consist of breaking, mounting, and surface grinding.
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Covered in this report
The report covers the present scenario and the growth prospects of the global wafer dicing saws market for 2017-2021. To calculate the market size, the report considers the revenues from major wafer dicing saws vendors..
The market is divided into the following segments based on geography:
Americas, APAC, EMEA
Research report, The report covers the present scenario and the growth prospects of the global Wafer Dicing Saws market for 2017-2021. To calculate the market size, the report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.
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Key vendors – DISCO Corporation, TOKYO SEIMITSU, Advanced Dicing Technology, Dynatex International, Loadpoint, Micross Components
Market driver - Growing demand for IoT, For a full, detailed list, view our report
Market challenge - Volatile nature of the semiconductor industry, For a full, detailed list, view our report
Market trend - Growth of AI, For a full, detailed list, view our report
Key questions answered in this report
What will the market size be in 2021 and what will the growth rate be? What are the key market trends? What is driving this market? What are the challenges to market growth? Who are the key vendors in this market space? What are the market opportunities and threats faced by the key vendors? What are the strengths and weaknesses of the key vendors?
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