Semiconductor wafers form an integral part of various components used abundantly in different electronic devices. The quality and performance of electronic devices is directly proportional to the quality of semiconductor wafers used in it.
High quality of wafer surface is very essential for suitable and easy fabrication of very large scale integration (VLSI) and ultra large scale integration (ULSI) circuits. Thus, utmost quality standards is followed in the manufacturing process of semiconductor wafers to make them free from contamination.
Wet based wafer cleaning equipment uses pure water and chemicals to remove any stains and dust that cause hindrance in the manufacturing process of semiconductor wafers.
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Rapidly growing semiconductor industry across the globe is one of the most important factor predicted to accelerate the demand of wet based wafer cleaning equipment during the forecast period from 2017 to 2025. Increasing demand of semiconductor wafer for different application areas such as consumer electronic devices, sensor devices, communication and memory devices among others is predicted to increase the production of semiconductor wafers.
This in turn, is anticipated to increase the demand of wet based wafer cleaning equipment owing to low cost of ownership and complying with various safety standards. Moreover, the rising trend of miniaturizing semiconductor integrated circuits (ICs) is expected to trigger the production of compact semiconductor wafers, which in turn is anticipated to augment the demand of wet based wafer cleaning equipment globally.
In order to provide a detailed and in-depth analysis of the market, the global wet based wafer cleaning equipment market has been segmented on the basis of application and end user. Based on removal of elements, by application, the market has been classified into chemical contamination, metallic contamination and particle contamination.
In addition, data related to demand for wet based wafer cleaning equipment across various end user industry including radio frequency identification (RFID) devices, logic and memory, micro electro mechanical system (MEMS), CMOS (complementary metal oxide semiconductor) image sensor and power devices is also provided in this report.
Among the different applications, removal of metallic contamination held the largest market share in 2016 and is expected to hold its leading position in the coming years. Metallic contamination is one of the prime reasons for semiconductor device failure.
Metallic contamination adversely affects semiconductor device performance. When wafer is contaminated with metallic impurities, it is known as metallic contamination.
Aluminum (Al), Copper (Cu), Chromium (Cr), Iron (Fe), Zinc (Zn), and Nickel (Ni) are some of the common contaminants. Metallic contaminants primarily cleaned by using water and liquid chemicals.
Geographically, in 2016, Asia Pacific region generated the revenue in the global wet based wafer cleaning equipment and is also predicted to experience the highest growth during the forecast period from 2017 to 2025. The market of wet based wafer cleaning equipment in Asia Pacific region is majorly driven by the countries such as China, Taiwan and India among others.
Huge concentration of semiconductor manufacturing company in this region coupled with increasing demand for technologically advanced and superior performing electronic devices is the most important factor anticipated to accelerate the demand of thinned and clean wafers. This in turn is predicted to boost the demand of wet based wafer cleaning equipment in Asia Pacific region.
Some of the major players supplying wet based wafer cleaning equipment across the globe includes SCREEN Holdings Co. Ltd. (Japan), Cleaning Technologies Group (The U.S), Modutek Corporation (The U.S), Lam Research Corporation (the U.S) and Tokyo Electron Limited (Japan) among others.
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