The Global Surface Mount Technology Equipment market is estimated at $3.26 billion in 2016 and is expected to reach $6.21 billion by 2023 growing at a CAGR of 9.6% from 2016 to 2023
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According to Stratistics MRC, the Global Surface Mount Technology Equipment is propelled by factors such as rising acceptance of electric vehicles, growing demand for LED lighting, rising use of flexible materials printed circuit boards and rising usage of flex circuits in electronic devices.
In addition, government initiatives and useful application of the equipments across a number of end user industries are some of the factors anticipated to provide growth opportunities for the market.
However, high investment cost of machinery for setting up production units and high cost of equipment are hindering the market growth.
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Amongst equipments, placement equipment is anticipated to hold the major share in the overall market during the forecast period. The growth for this segment is mainly driven by the need for higher accuracy, product miniaturization, improved speed, and flexibility.
By Application, consumer electronics held the largest market share which can be attributed to the growing miniaturization of electronic devices. Asia Pacific dominated the global market during the forecast period due to the booming electronic contract manufacturing into this region.
Moreover, GDP growth and rising infrastructural improvement in this region offers great growth opportunities for the market.
Some of the key players in the market include
Yamaha, Viscom AG, Panasonic, Orbotech Ltd.,
Nordson Corporation, Mycronic AB, Juki Corporation, Hitachi High-Technologies Corporation,
Fuji Machine Manufacturing Co., Ltd., Electro Scientific Industries, Inc., Cyberoptics Corporation, Assembléon, ASM Assembly Systems GmbH & Co. Kg, KLA-Tencor Corporation and Allen Organ Company LLC.
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• Soldering Equipment
o Reflow Oven
o Wave Oven
• Placement Equipment
o Based on Type
o Based on Speed
• Inspection Equipment
o X-Ray Inspection Equipment
o Optical Inspection Equipment
o Laser Inspection Equipment
• Cleaning Equipment
• Repair and Rework Equipment
• Screen Printing Equipment
• Transistor & Diodes
• Passive Surface-Mount Devices
• Integrated Circuits
• Aftermarket Services
• Test and Prototype
• Supply Chain Services
• Aerospace & Defense
• Consumer Electronics
• Energy and Power Systems
• Other Application
• North America
o Rest of Europe
• Asia Pacific
o New Zealand
o Rest of Asia Pacific
• Rest of the World
o Middle East
o South Africa
What our report offers:
- Market share assessments for the regional and country level segments
- Market share analysis of the top industry players
- Strategic recommendations for the new entrants
- Market forecasts for a minimum of 7 years of all the mentioned segments, sub segments and the regional markets
- Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
- Strategic recommendations in key business segments based on the market estimations
- Competitive landscaping mapping the key common trends
- Company profiling with detailed strategies, financials, and recent developments
- Supply chain trends mapping the latest technological advancements
Table Of Content
1 Executive Summary
2.2 Stake Holders
2.3 Research Scope
2.4 Research Methodology
2.4.1 Data Mining
2.4.2 Data Analysis
2.4.3 Data Validation
2.4.4 Research Approach
2.5 Research Sources
2.5.1 Primary Research Sources
2.5.2 Secondary Research Sources
3 Market Trend Analysis
3.6 Application Analysis
3.7 Emerging Markets
3.8 Futuristic Market Scenario
4 Porters Five Force Analysis
4.1 Bargaining power of suppliers
4.2 Bargaining power of buyers
4.3 Threat of substitutes
4.4 Threat of new entrants
4.5 Competitive rivalry
5 Global Surface Mount Technology Equipment Market, By Equipment
5.2 Soldering Equipment
5.2.1 Reflow Oven
5.2.2 Wave Oven
5.3 Placement Equipment
5.3.1 Based on Type
220.127.116.11 Multi-Head Placement Machine
18.104.22.168 Dual-Delivery Placement Machine
22.214.171.124 Multi-Station Placement Machine
126.96.36.199 Sequential Pick-And-Place Machine
188.8.131.52 Turret-Type Placement Machine
5.3.2 Based on Speed
184.108.40.206 Medium-Speed Placement Equipment
220.127.116.11 High-Speed Placement Equipment
18.104.22.168 Low-Speed Placement Equipment
5.4 Inspection Equipment
5.4.1 X-Ray Inspection Equipment
5.4.2 Optical Inspection Equipment
5.4.3 Laser Inspection Equipment
5.5 Cleaning Equipment
5.6 Repair and Rework Equipment
5.7 Screen Printing Equipment
11 Company Profiling
11.2 Viscom AG
11.4 Orbotech Ltd.
11.5 Nordson Corporation
11.6 Mycronic AB
11.7 Juki Corporation
11.8 Hitachi High-Technologies Corporation
11.9 Fuji Machine Manufacturing Co., Ltd.
11.10 Electro Scientific Industries, Inc.
11.11 Cyberoptics Corporation
11.13 ASM Assembly Systems GmbH & Co. Kg
11.14 KLA-Tencor Corporation
11.15 Allen Organ Company LLC.
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