The requirement for enhancing the dependability of flip chip bundles among semiconductor producers is a key factor fortifying the interest for Electronic Underfill Materials crosswise over different end-utilize enterprises.
The interest for Electronic Underfill Materials is essentially determined by the requirement for scaling down of electronic gadgets, better interconnect densities, improved electrical execution, and littler item sizes.
The utilization of Electronic Underfill Materials has been reported to offer a few advantages to gadgets bundling, for example, unrivaled chip impression configuration, better warm cycling resistance, weight on the weld knocks, in this way enhancing the dependability of different flip chip items. This is a key factor moving the interest for Electronic Underfill Materials.
“United States Electronic Underfill Material Market Research Report 2017”
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The market for underfill materials is relied upon to witness striking surge because of the developing interest of portable electronic items. The taking off interest for lighter, littler, and speedier electronic items is relied upon to expand the take-up of underfill materials sooner rather than later as they offer the perfect measure of mechanical quality to bind joints of PCB and enhance affect resistance.
The key preferred standpoint of underfill material is their capacity to upgrade the warm cycling resistance, which additionally enhances its general dependability. The developing interest for flip chip innovation and rising prevalence of copper columns are anticipated to impact the powerful development of the underfill material market amid the figure time frame.
The variables keeping the market down are the strengthening weight of descending valuing and costly cost of materials.
United States Electronic Underfill Material market competition by top manufacturers/players, with Electronic Underfill Material sales volume, price, revenue (Million USD) and market share for each manufacturer/player; the top players including
- Nordson Corporation
- H.B. Fuller
- Epoxy Technology Inc.
- Yincae Advanced Material, LLC
- Master Bond Inc.
- Zymet Inc.
- AIM Metals & Alloys LP
- Won Chemicals Co. Ltd
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On the basis of product, this report displays the sales volume, revenue, product price, market share and growth rate of each type, primarily split into
- Capillary Underfill Material (CUF)
- No Flow Underfill Material (NUF)
- Molded Underfill Material (MUF)
On the basis on the end users/applications, this report focuses on the status and outlook for major applications/end users, sales volume, market share and growth rate of Electronic Underfill Material for each application, including
- Flip Chips
- Ball Grid Array (BGA)
- Chip Scale Packaging (CSP)
Geographically, this report splits the United States market into seven regions:
- The West
- The Middle Atlantic
- New England
- The South
- The Midwest
with sales (volume), revenue (value), market share and growth rate of Electronic Underfill Material in these regions, from 2012 to 2022 (forecast).
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