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Semiconductor advanced packaging market rise at CAGR 8.45% by 2021 according to new research report

Semiconductor Advanced Packaging Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market. The analysts forecast Global Semiconductor Advanced Packaging Market to grow at a CAGR of 8.45% during the period 2017-2021.

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The following companies as the key players in the Global Semiconductor Advanced Packaging Market: Advanced Semiconductor Engineering (ASE), Amkor Technology, Samsung Semiconductor (SAMSUNG), and TSMC (Taiwan Semiconductor Manufacturing Company).

Report at www.rnrmarketresearch.com/contacts/1160562

About Semiconductor Advanced Packaging

Semiconductor packaging is carried out to provide protection to the wafer or substrate. The casing (package) is built from materials such as plastic, metal, glass, or ceramic and contains one or more semiconductor electronic components.

Semiconductor advanced packaging is a key component of the semiconductor manufacturing process.

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The package of a semiconductor device is usually made of materials such as plastic, metal, ceramic/glass.

Packaging is undertaken to provide protection against impact and corrosion. It also has contact pins or leads used to connect external circuits to the device; the package also dissipates the heat produced in the device.

Some of the advanced packaging technologies used in semiconductor device packaging are fan-out wafer-level packaging (FO WLP), flip-chip, fan-in wafer-level packaging (FI WLP), and 2.5D/3D.

Report at www.rnrmarketresearch.com/contacts/?rname=1160562


The latest trend gaining momentum in the market is Changes in wafer size. The semiconductor industry has seen a drastic transition in wafer size over the last five decades (1910-2016).

The industry is focusing on producing larger diameter wafers, which is expected to cut down the manufacturing cost by 20%-25%. As of 2016, the semiconductor industry is using 300-mm wafer, with foundries investing in developing more such fabs.

For instance, SK Hynix is building an M14 fab for the 300-mm technology in South Korea.”

According to the report, one of the major drivers for this market is Complex semiconductor IC designs. The number of features and functionalities offered by consumer electronic devices is on the rise as electronic device manufacturers look to differentiate their offerings from those of competitors.

Consequently, there has been increasing need for multifunctional ICs. Semiconductor device manufacturers have addressed this need by developing new and more complex architecture and designs for semiconductor ICs.

An instance of this is the development of 3D ICs, which are compact, consume less power, and are highly efficient, but also have complex designs and elaborate manufacturing processes.


Further, the report states that one of the major factors hindering the growth of this market is Rapid technological changes. The rapid technological advancements in wafer processing have always been a major challenge faced by vendors in the semiconductor advanced packaging market.

The semiconductor industry is continuously seeing transitions, such as the miniaturization of nodes and the increase in wafer sizes with respect to ultra-large-scale integration (ULSI) fabrication technology. This prompts semiconductor manufacturers to increase the development and adoption of new technologies, especially packaging solutions.

Hence, to withstand the competition in the market, packaging vendors must develop new technologies that are in line with the changes in semiconductor IC architecture. As a result, manufacturers incur high costs on R&D.


The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.

Covered in this report

The report covers the present scenario and the growth prospects of the global semiconductor advanced packaging market for 2017-2021. To calculate the market size, the report considers the sale of semiconductor capital equipment to end-use segments.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA

 Report at www.rnrmarketresearch.com/contacts…=1160562

Key vendors

  • Advanced Semiconductor Engineering (ASE)
  • Amkor Technology
  • Samsung Semiconductor (SAMSUNG)
  • TSMC (Taiwan Semiconductor Manufacturing Company)
  • Other prominent vendors
  • China Wafer Level CSP
  • ChipMOS TECHNOLOGIES
  • FlipChip International
  • HANA Micron
  • Interconnect Systems (Molex)
  • Jiangsu Changjiang Electronics Technology (JCET)
  • King Yuan Electronics
  • Tongfu Microelectronics
  • Nepes
  • Powertech Technology (PTI)
  • SIGNETICS
  • Tianshui Huatian
  • Ultratech
  • UTAC

Market driver

  • Complex semiconductor IC designs
  • For a full, detailed list, view our report

Market challenge

  • Rapid technological changes
  • For a full, detailed list, view our report

Market trend

  • Changes in wafer size
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2021 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?

Table of Contents

  • PART 01: Executive summary
  • PART 02: Scope of the report
  • PART 03: Research Methodology
  • PART 04: Introduction
  • PART 05: Technology landscape
  • PART 06: Market landscape
  • PART 07: Segmentation by packaging technology
  • PART 08: Segmentation by device type
  • PART 09: Geographical segmentation
  • PART 10: Decision framework
  • PART 11: Drivers and challenges
  • PART 12: Market trends
  • PART 13: Vendor landscape
  • PART 14: Appendix

 

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