Experts have also have a pragmatic view on the significant upsurge in the number of acquisitions in the coming years as comparison to the ones that have occurred in the last couple of years.
Wafer inspection systems are required for timely detection of physical and technological defects present within wafers. Currently, both e-beam and optical technologies are used in the detection of defects in wafers.
Increasing applications of thin wafers in manufacturing small or miniaturized devices used in micro-electro mechanical systems, laptops, and smartphones among others have bolstered the demand for e-beam wafer inspection system. Also the market is forecast to gain from the persistently rising activities in the semiconductor industry.
Spurred by the aforementioned factors, the global e-beam wafer inspection system market is forecast to exhibit a CAGR of 17.5% between 2015 and 2025. Rising at this rate, the market will reach US$1.06 bn by the end of 2025, from US$248.3 million in 2016.
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Based on type, the global e-beam wafer inspection system market is segmented into less than 1 nm, 1 to 10 nm and more than 10 nm inspection resolution system. In 2016, e-beam wafer inspection system market was dominated by more than 10 nm wafer inspection systems, followed by the other two segments.
However, during the forecast period the less than 1 nm segment will showcase a higher CAGR.
On the basis of application, the global e-beam wafer inspection system market has been segmented into defect imaging, lithographic qualification, bare wafer OQC/IQC, wafer dispositioning, reticle quality inspection, and inspector recipe optimization. Of these, defect imaging formed the largest application segment with a share of 38.5% in the market in 2016.
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Regionally, Asia Pacific, Europe, North America, Latin America, and the Middle East and Africa constitute the key segments in the global e-beam wafer inspection system market. Among these nations, Asia Pacific emerged dominant holding a little short of 60% share in the global market in 2016.
In addition, North America and Europe have been demonstrating lucrative market opportunities over the last few years. These regions boast high investment in the research and development, which has led to extensive application of high quality wafers across diverse industries.
Some of the leading players in the global e-beam wafer inspection system market are Hitachi Ltd. (Japan), ASML Holding N.V. (Netherlands), KLA Tencor Corporation (The U.S.), Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan), NXP Semiconductors N.V. (Netherlands), Lam Research Corporation (The U.S.), Renesas Electronics Corporation (Japan), Integrated Device Technology Inc. (The U.S.), Applied Materials Inc. (The U.S.), and Synopsys Inc. (The U.S.) among others.
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