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Learn details of the chip on flex market to grow at CAGR of 6.43% and reach USD 1795 million by 2023

Learn details of the chip on flex market to grow at CAGR of 6.43% and reach USD 1795 million by 2023

The global chip on flex market has been segmented on the basis of types, applications and verticals. The types of chip on flex are one sided chip on flex and others. The applications comprises of static and dynamic flexing.

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The Global Chip on Flex Market is estimated to grow from USD1537 million in 2018 to USD 1795 million by 2023, at an expected CAGR of 6.43%.

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The major drivers for the growth of this market are cumulative need for small and flexible electronics in various applications such as displays, sensors, lighting, biomedical implants, and radio frequency identification between others and the rapid technological advancements which lead to accurate designs and automated production, of flex circuits that helps to eliminate human errors once involved in hand-built wire harnesses.

The various verticals of chip on flex market are military, medical, aerospace, electronics and others.

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The electronic industry along with the wide variety of technology used and the customer needs changing to efficient, cheaper and powerful customer electronics and mobile technologies.

Complete report on Chip on Flex Market spread across 132 pages, profiling 10 companies and supported with tables and figures. Inquire for more at www.orianresearch.com/discount/400876.

Chip on flex has some important features such as heat sinks, component assembly, penalization, shielding, over molding and graphic overlay among others which makes it more acceptable among end users such as electronic industry, aerospace, defense and others.

Global Chip on Flex Market refers to the semiconductor assembly technology wherein the microchip or die is directly mounted on and electrically connected to a flexible circuit which is a circuit built on a flexible substrate instead of the usual printed circuit board.

The major key players in the market of Chip on Flex market are - lgit corporation, stemko group, FL exceed, chip bond technology corporation, cwe, dan bond technology co. Ltd., akm industrial company ltd., compass technology company limited, compunetics, and stars microelectronics public company ltd among others.

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Key Benefits for this report

*This report provides current market trends and future growth expectations.

*This report examines the market size and changing competitive dynamics

*It covers information regarding key drivers, challenges or restraining market growth

*It provides a five-year forecast assessed on the basis market value chain, Porter's five forces, and supply chain management.

*Market factor analysis delivers treasured information regarding the possible purchasers and suppliers and understanding the stakeholders involved.

*This report incorporates data regarding companies and business decision by having complete insights on the markets and by creating in-depth analysis of market segments.

 

Target Audience

* Research institutions

* Government institutions

* Cof manufactures

* Industries such as aerospace, automotive, it, industrial, and medical, among others

 

Table of Content

1 Executive Summary

2 Demographic Overview

3 Research Methodology

4 Premium Insights

5 Market Overview

6 Market Factor Analysis

7 Global Chip on Flex Market By Application

8 Global Chip on Flex Market By Type  

9 Global Chip on Flex Market By Vertical

10 Global Market Chip on Flex Market Analysis By Region

11 Market Trends & competitive Analysis

12 Company Profiles

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