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Research delivers insight into the innovative study of global thermal management market report

Industrial Market Research

Focusing on Major Players like Aavid Thermalloy LLC., Vertiv Co., European Thermodynamics Ltd.

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The Global Thermal Management Market accounted for USD 10.7 billion in 2016 growing at a CAGR of 6.9% during the forecast period of 2017 to 2024. The upcoming market report contains data for historic year 2014, 2015, the base year of calculation is 2016 and the forecast period is 2017 to 2024.

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Global Thermal Management Market by Geography (North America, Europe, Asia-Pacific, Europe, South America, Middle East and Africa); Material Type (Adhesive Material, Non-adhesive Material); Device (Conduction Cooling Devices, Convection Cooling Devices, Advanced Cooling Devices, Hybrid Cooling Devices); End-User Application (Aerospace and Defense, Automotive, Servers and Data Centers, Consumer Electronics, Healthcare); Product (Hardware, Software, Interfaces, And Substrates), Service (Installation and Calibration, Optimization and Post-Sales Support) – Industry Trends and Forecast to 2024

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Major Market Drivers:

  • Increasing Demand for Thermal Management in Consumer Electronics
  • Increasing focus on improving energy efficiency and performance of automobiles
  • Increasing demand for low power consumption devices
  • High adoption of thermal management system in wide range of applications
  • Modularity issues in designing
  • Component level complexities in development and incorporation

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Market Segmentation:

On the basis of material type:- Adhesive material, and non-adhesive material. The adhesive material segment is further sub-segmented into thermal tapes, films, and adhesive liquids.

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The films segment is further sub-segmented into thermally conductive films, and electrically conductive films. The adhesive liquids segment is further sub-segmented into heat cure liquid, and room temperature cure.

The non-adhesive material segment is further sub-segmented into thermal pads, gap fillers, phase change materials, and grease.

On the basis of device:- Conduction cooling devices, convection cooling devices, advanced cooling devices, and hybrid cooling devices. The conduction cooling devices segment is further sub-segmented into wedge locks, and potting materials.

On the basis of end-user application:- aerospace and defense, automotive, servers and data centers, consumer electronics, healthcare.

On the basis of technology :- Hardware, software, interfaces, and substrates.

On the basis of product:- Hardware, software, interfaces, and substrates.

On the basis of service:- Installation and calibration, and optimization and post-sales support.

On the basis of geography:- North America, South America, Europe, Asia-Pacific, and Middle East & Africa. U.S., Canada, Germany, France, U.K., Netherlands, Switzerland, Turkey, Russia, China, India, South Korea, Japan, Australia, Singapore, Saudi Arabia, South Africa, and Brazil among others.

In 2017, North America is expected to dominate the market.

 Major Market Competitors: 

Some of the major players of the global thermal management market are

  • Honeywell International Inc.,
  • Aavid Thermalloy LLC.,
  • Vertiv Co.,
  • European Thermodynamics Ltd.,
  • Master Bond Inc.,
  • Laird PLC,
  • Henkel AG & Company,
  • KGaA ,
  • Delta Electronics, Inc.,
  • Advanced Cooling Technologies, Inc.,
  • Dau Thermal Solutions Inc,
  • Amerasia International (AI) Technology Inc.,
  • Heatex AB,
  • Lord Corporation,
  • Parker Chomerics,
  • AI Technology,
  • Hamon & Cie International S.A.,
  • Lairdtech,
  • API Heat Transfer Inc.,
  • Danfoss S.A.,
  • Spx Corporation,
  • Momentive Performance Materials,
  • Chart Industries, Inc.,
  • Brooks Automation, Inc.,
  • Sunpower, Inc.,
  • among others.

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