Thermal Management is the ability to control the temperature of a system using technology based on thermodynamics and heat transfer. Thermal management therefore, includes all the possible procedures like conduction, radiation, convection, heat transfer, and others in order to control the temperature of a framed system. Most of the devices generate huge amount of heat and thus, require thermal management in order to avoid failures at an early stage. The thermal management systems thus have widespread applications in servers and data centers, healthcare, consumer electronics, aerospace and defense, automotive and others. The rising demand for thermal management is mainly due to their functionality and reliability in its wide range of applications resulting in continued operational processes.
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The Global Thermal Management Market accounted for USD 10.7 billion in 2016 growing at a CAGR of 6.9% during the forecast period of 2017 to 2024. The upcoming market report contains data for historic year 2014, 2015, the base year of calculation is 2016 and the forecast period is 2017 to 2024.
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Global Thermal Management Market by Geography (North America, Europe, Asia-Pacific, Europe, South America, Middle East and Africa); Material Type (Adhesive Material, Non-adhesive Material); Device (Conduction Cooling Devices, Convection Cooling Devices, Advanced Cooling Devices, Hybrid Cooling Devices); End-User Application (Aerospace and Defense, Automotive, Servers and Data Centers, Consumer Electronics, Healthcare); Product (Hardware, Software, Interfaces, And Substrates), Service (Installation and Calibration, Optimization and Post-Sales Support) – Industry Trends and Forecast to 2024
New research report with figures as recent as 2017 and forecasts up to 2024 that helps you track the unprecedented growth seen in the Semiconductor industry giving you an edge to not just compete but to outmatch the competition.
The report for global thermal management market include detailed vendor level analysis for market shares in 2016 for Global, North America, Europe, Asia Pacific, Middle East and Africa and South America specifically.
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Also impact and development analysis of key vendors is registered in the market and factored on the basis of Vendor Positioning Grid Analysis which measures the vendors strengths and opportunities against present market challenges, measure providers ability to identify or satisfy present market needs, map providers market vision to current and upcoming market dynamics among others. The report also measures technology life line curve and market time line to analyze and do more affective investments.
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Major Market Drivers:
- Increasing Demand for Thermal Management in Consumer Electronics
- Increasing focus on improving energy efficiency and performance of automobiles
- Increasing demand for low power consumption devices
- High adoption of thermal management system in wide range of applications
- Modularity issues in designing
- Component level complexities in development and incorporation
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On the basis of material type:- Adhesive material, and non-adhesive material. The adhesive material segment is further sub-segmented into thermal tapes, films, and adhesive liquids.
The films segment is further sub-segmented into thermally conductive films, and electrically conductive films. The adhesive liquids segment is further sub-segmented into heat cure liquid, and room temperature cure.
The non-adhesive material segment is further sub-segmented into thermal pads, gap fillers, phase change materials, and grease.
On the basis of device:- Conduction cooling devices, convection cooling devices, advanced cooling devices, and hybrid cooling devices. The conduction cooling devices segment is further sub-segmented into wedge locks, and potting materials.
On the basis of end-user application:- aerospace and defense, automotive, servers and data centers, consumer electronics, healthcare.
On the basis of technology :- Hardware, software, interfaces, and substrates.
On the basis of product:- Hardware, software, interfaces, and substrates.
On the basis of service:- Installation and calibration, and optimization and post-sales support.
On the basis of geography:- North America, South America, Europe, Asia-Pacific, and Middle East & Africa. U.S., Canada, Germany, France, U.K., Netherlands, Switzerland, Turkey, Russia, China, India, South Korea, Japan, Australia, Singapore, Saudi Arabia, South Africa, and Brazil among others.
In 2017, North America is expected to dominate the market.
Major Market Competitors:
Some of the major players of the global thermal management market are
- Honeywell International Inc.,
- Aavid Thermalloy LLC.,
- Vertiv Co.,
- European Thermodynamics Ltd.,
- Master Bond Inc.,
- Laird PLC,
- Henkel AG & Company,
- KGaA ,
- Delta Electronics, Inc.,
- Advanced Cooling Technologies, Inc.,
- Dau Thermal Solutions Inc,
- Amerasia International (AI) Technology Inc.,
- Heatex AB,
- Lord Corporation,
- Parker Chomerics,
- AI Technology,
- Hamon & Cie International S.A.,
- API Heat Transfer Inc.,
- Danfoss S.A.,
- Spx Corporation,
- Momentive Performance Materials,
- Chart Industries, Inc.,
- Brooks Automation, Inc.,
- Sunpower, Inc.,
- among others.
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