Study papers on Hermetic Packaging market and regional forecast. Hermetic Packaging market players are Schott AG (Germany), AMETEK (US), Amkor Technology (US), Texas Instruments (US), Teledyne Microelectronics (US), Kyocera Corporation (Japan), Materion Corporation (Japan), Egide (France), Micross Components. (US), Legacy Technologies Inc. (US).
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Hermetic packaging market is expected to grow from USD 3.25 billion in 2018to 4.52billion by 2023, at a CAGR of 6.80% between 2018 and 2023. The need of a packaging method that can protect highly sensitive electronic components for several years and the growing demand for hermetically packaged components from industries, such as automotive, electronics, and aeronautics and space, are some of the major drivers for the hermetic packaging market.
However, stringent military standards for hermetic packaging is a key factor restraining the growth of this market.
- Original design manufacturers (ODMs)
- Component suppliers
- Research organizations and consulting companies
- Application providers
- Subcomponent manufacturers
- Maintenance and service providers
- Technology providers
- Associations, organizations, forums, and alliances related to hermetic packaging
The market in APAC is expected to hold the largest share by2023, and is estimated to grow at the highest rate.
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With the increasing population, energy needs of the countries in APAC are also expected to increase. Along with this, the developing countries, such as China and India, are expected to sustain the high GDP growth rate.
These factors are expected to create huge opportunities for manufacturers of hermetically packaged components in APAC. Further, developing countries such as China, Japan, and India are now striving to compete in the space industry with the developed countries across the world.
For instance, in August 2016, China launched the first-ever quantum satellite in an effort to develop an un-hack able communications system. Such efforts by the countries in APAC help sustain a competitive position in the space industry and is also expected to add to the growth of hermetic packaging market in APAC during the forecast period.
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The military & defense industry is expected to capture the largest market share in 2018. High defense budget allocation by the North American countries—the US, Canada, and Mexico; and rising adoption of hermetically packaged components for border security needs by developing countries, such as China and India, across APAC are expected to contribute to the growth of the hermetic packaging market for the military & defense industry.
2 Ranking of Players, 2017
3 Competitive Scenario
3.1 Product Launches
3.2 Agreements, Partnerships, Collaborations, Contracts, & Joint Ventures
3.3 Mergers & Acquisitions
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- The market is segmented on the basis of configuration into multilayer ceramic packages, metal can packages, and pressed ceramic packages.
- The market is segmented, on the basis of type, into ceramic-metal (CERTM)sealing, glass-metal sealing (GTMS), passivation glass, transponder glass, and reed glass.
- The market is segmented, on the basis of application, into transistors, sensors, lasers, airbag ignitors, photodiodes, oscillating crystals, MEMS switches, and others.
- The market is segmented, on the basis of industry, into military & defense, aeronautics and space, automotive, energy and nuclear safety, medical, telecommunications, consumer electronics, and others.
- The geographic analysis is done with regard to 4major regions-North America, Europe, APAC, and RoW).
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