Semiconductor Assembly and Testing Services Market Report | Global Industry Outlook, Analysis and Forecast 2016-2022
The Global Semiconductor Assembly and Testing Services market is expected to grow at USD ~43 billion by the end of year 2022 with ~5% of CAGR.
Browse details of 76 pages research report on Global Semiconductor Assembly and Testing Services market at www.researchcosmos.com/reports/sem…-and-fo/850579254
Today, the semiconductor industry is more than of USD 400 billion and with the rise in the spending in investment in the in development of new products, the market will continue to show the positive growth rate in the coming picture. This is the main factor which is driving the market of semiconductor assembly and testing services whereas changing technological environment, government rules towards the use of ecofriendly environment and e-wastage is expected to hinder the market growth during forecast period.
For the purpose of this study, Research Cosmos has segmented the market of Semiconductor Assembly and Testing Services into Services and Application.
Services includes assembly, packaging and testing whereas the applications have been segmented as consumer electronics, IT, Telecommunication, Automotive, Industrial among others.
The prominent players in the Semiconductor Assembly and Testing Services Market are –Advanced Semiconductor Engineering, Inc. (U.S.), Amkor Technology, Inc. (U.S.), Siliconware Precision Industries Co., Ltd.
(Taiwan), STATS ChipPAC Ltd (Signapore), Powertech Technology Inc. (Taiwan), CORWIL Technology (U.S.), Chipbond Technology Corporation (U.S.), Integrated Micro-Electronics, Inc.
(U.S.), GlobalFoundries (U.S.) among others.
Semiconductor Assembly and Testing Services (SATS) Market – Segmentation
The Global Semiconductor Assembly and Testing Services (SATS) is segmented in to 4 key dynamics for the convenience of the report and enhanced understanding;
Segmentation by Services: Comprising assembly, packaging and testing.
Segmentation by Application: Comprising consumer electronics, Information technology, telecommunications and automotive industrial.
Segmentation by Packaging Solution: Comprises Copper wire and gold wire bonding, Copper clip, Flip chip, Wafer level packaging, TSV.
Segmentation by Regions: Comprises Geographical regions - North America, Europe, APAC and Rest of the World.
Market Research Analysis:
Today, the market of semiconductor products is increasing at exponential rate. High consumption of products in the different regions is giving huge pressure on the OEMs.
As the technology is growing, the average life cycle of products is decreasing due to the availability of substitutes. For the expansion and business growth, companies are adopting multiple business strategies including mergers and acquisition.
In last five years, the R&D expense of companies has increased tremendously due to the increase in the revenue and growing competition. Research Cosmos has predicted that Asia-Pacific is dominating the market of Semiconductor Assembly and Testing Services due to the rich presence of semiconductor manufacturing companies in China, Japan, South Korea and Taiwan.
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