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Thin-film encapsulation (tfe) market worth 101.1 million USD by 2023 according to market forecasts

Industrial Market Research

The thin-film encapsulation (TFE) market for materials was valued at USD 13.1 Million in 2017 and is expected to reach USD 101.1 Million by 2023, at a CAGR of 26.1% during the forecast period. The base year considered for the study is 2017, and the forecast period is between 2018 and 2023.

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According to the new market research report "Thin-Film Encapsulation (TFE) Market by Application (OLED Display, Lighting, Thin-Film Photovoltaics), Deposition Technology (Inorganic Layers (PECVD, ALD) and Organic Layers (Inkjet Printing and VTE)), and Geography - Global Forecast to 2023", The thin-film encapsulation market for materialsis expected to grow from USD 31.7 Million in 2018 to USD 101.1 Million by 2023, at a CAGR of 26.1% between 2018 and 2023.

Browse 13 market data Tables and 38 Figures spread through 104 Pages and in-depth TOC on "Thin-Film Encapsulation (TFE) Market - Global Forecast to 2023 "
www.marketsandmarkets.com/Market-R…et-255749417.html

The thin-film encapsulation  market for materialscovers  the thin-film organic and inorganic barriers used at the manufacturing level of  flexible OLED displays, flexible OLED lighting, thin-film photovoltaics, and  other products. The need for thin-film barriers in flexible and organic devices,  trend of thin-film encapsulation using inkjet  printing technology, and rapid adoption of flexible OLED displays for smartphones  and smart wearables significantly drive the market growth.

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The growing  investments in the OLED technology and manufacturing facilities and rising  adoption of thin-film solar cells are likely to provide lucrative opportunities  for the market players in the near future.

Download PDF Brochure at www.marketsandmarkets.com/pdfdownload.asp?id=255749417

Rising demand for flexible OLED displays and flexible OLED lighting solutions is driving the growth of thin-film encapsulation market for materials

OLED displays accounted for the largest share of the thin-film encapsulation market for materials, in terms of value, in 2017. Samsung SDI and LG Chem develop thin-film encapsulation materials for flexible OLED displays.

These companies are also working with thin-film encapsulation equipment suppliers, such as Kateeva and Applied Materials. The thin-film encapsulation market for materials in OLED lighting applications is expected to grow at the highest CAGR of 31.8% during the forecast period.

APAC is expected to hold the largest market share between 2018 and 2023

APAC accounted for the largest share of the thin-film encapsulation market for materials in 2017. Major display panel and brand product manufacturers are based in China, Japan, Taiwan, South Korea, and Hong Kong.

South Korea witnessed the highest demand for thin-film encapsulation materials in 2017 owing to presence of industry leaders such as Samsung and LG Display in the country. Further, the demand for thin-film encapsulation materials from China is expected to increase rapidly during 2018–2023 as various Chinese players, such as BOE Technology and CSOT, are planning to construct facilities to manufacture flexible OLED panels.

Report: www.marketsandmarkets.com/.asp?id=255749417

The leading suppliers of thin-film encapsulation equipment and materials in the market are Samsung SDI (Novaled) (South Korea), LG Chem (South Korea), Universal Display Corp. (UDC) (US), Applied Materials (US), 3M (US), Veeco Instruments (US), Kateeva (US), Toray Industries (Japan), BASF (Rolic) (Germany), Meyer Burger (Switzerland), Aixtron (Germany), Bystronic Glass (Germany), AMS Technologies (Germany), and Angstrom Engineering (Canada).

Key innovators profiled in this report include Beneq (Finland), Encapsulix (France), Lotus Applied Technology (US), Vitriflex (US), and Picodeon (Finland).

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