Industrial, Manufacturing & Heavy Industry Market News

New report examines the Global interposer and fan-out WLP market volume to grow at +30.76% of CAGR to 2024

WLP stands for wafer level packaging. It involves packaging the chip on the wafer, rather than slicing the wafer first into individual chips and then packaging them.Such packaging techniques, deliver greater bandwidth, speed, and reliability.


Market Analysis:

The Global Interposer and Fan-Out WLP Market accounted for USD 10.09 billion in 2016 growing at a CAGR of 30.76% during the forecast period of 2017 to 2024. The upcoming market report contains data for historic year 2014, 2015, the base year of calculation is 2016 and the forecast period is 2017 to 2024.

This report consists of below pages:

  • No of pages: 350
  • No of Figures: 60
  • No of Tables: 220

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Report Definition:

WLP stands for wafer level packaging. It involves packaging the chip on the wafer, rather than slicing the wafer first into individual chips and then packaging them.