The global 3D semiconductor packaging market is majorly driven by increase in number of portable electronic devices, short replacement period of electronics products, and technological superiorities over 2D packaging technology. However, high initial capital investment would act as a restraint for the market. Growing trend of internet of things would provide several growth opportunities for the market in the coming years.
Global 3D Semiconductor Packaging Market Report, published by Variant Market Research, forecast that the global market was valued at $4 billion in 2016 and expected to reach $12 billion by 2024; growing at a CAGR of 15.2% from 2016 to 2024. In geographical segments, Asia-Pacific and Rest of the World (RoW) are anticipated to grow at a CAGR of 16.2% and 14.8%, respectively, over the forecast period 2016 - 2024.
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The global 3D semiconductor packaging market is majorly driven by growing number of portable electronic devices, demand for wearable devices, and advanced technological superiorities over 2D packaging technology. Though, high initial capital investment would act as a restraint for the market.Increasing trend of internet of things and minimum power consumption would provide growth opportunities for the market during the forecast period 2016 - 2024.
The global 3D semiconductor packaging market is categorized into material type, technology, and industry vertical. Material type segment contains encapsulation resin, bonding wire, organic substrate, ceramic package, leadframe, die attach material, and others.
Technology segment includes 3D wire-bonded, 3D package-on-package, 3D fan-out based, 3D through-silicon-via, and others. Industry vertical segment comprises electronics, industrial, healthcare, automotive & transport, IT & telecommunication, aerospace & defense, and others.
3D wire-bonded technology segment held the largest market share in 2016. Electronics is the predominant segment and accounted for around half of the total market share in 2016, driven by growing adoption of 3D semiconductor packaging in portable electronic devices.
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North America, Europe, Asia-Pacific and Rest of the World (RoW) are the major regions covered in the report. Asia-Pacific held largest market share in 2016 and it is anticipated to continue its dominance during the forecast period.
In terms of growth, Asia-Pacific is also expected to grow at the fastest CAGR of 16.2% during the forecast period 2016-2024. The growth is majorly attributed to growing demand for these chips in China, Taiwan, and Japan.
The major players in the 3D semiconductor packaging market are Amkor Technology, Siliconware Precision Industries Co., ASE group, Ltd., Jiangsu Changjiang Electronics Technology Co. Ltd., SÜSS MicroTec AG., International Business Machines Corporation (IBM), Qualcomm Technologies, Inc., STMicroelectronics, Intel Corporation, and Taiwan Semiconductor Manufacturing Company, among others.
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Scope of 3D Semiconductor Packaging Market
Technology Type Segments
- 3D package-on-package
- 3D wire-bonded
- 3D fan-out based
- 3D through-silicon-via
Materials Type Segments
- Bonding wire
- Organic substrate
- Encapsulation resin
- Ceramic package
- Die attach material
Industry Vertical Type Segments
- IT & telecommunication
- Automotive & transport
- Aerospace & defense
- North America
- South Korea
- South America
- Middle East
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