The exclusive advantages of fan-out WLP such as smaller form factor and thinner package with higher input/output (I/O) count along with improved thermal and electrical performance, makes it the exceptional wafer level integration solution. In addition, Fan-out WLP is gaining traction owing to its miniature size and fulfilling the requirement of higher integration level & increased number of external contacts in electronic devices. With the collective effect of these factors and extensive research and development activities, Fan-out WLP market is anticipated to witness a high growth in next 5-6 years.
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Wafer Level Packaging Market Report, published by Allied Market Research, forecasts that the global market is expected to garner $7.8 billion by 2022, registering a CAGR of 21.5% from 2016-2022. In the year 2015, Asia-Pacific dominated the global market and contributed over half of the market share owing to improved electronics industry infrastructure and increasing demand of electronic products such as smartphones, handheld devices, PCs and laptops among others.
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Wafer level packaging is growing with a notable rate owing to its competitive advantages over other conventional packaging technologies namely wire bonding and flip chip such as compact package footprints, increased functionality, improved thermal performance, and finer pitch interconnection to the printed circuit board. Wafer level packaging (WLP) can be categorized on the basis of integration type and packaging technology used in them.
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Furthermore, trending Internet of Things (IoT), technological superiority over traditional packaging techniques, and impending need of circuit miniaturization in microelectronic devices are key factors expected to propel the growth of global WLP market. Thriving demand for small sizes, low costs, and high performance of packaging solutions in electronic devices is going to act as an opportunity for wafer level packaging market.
In integration type of wafer level packaging, fan-in wafer level packaging (Fan-in WLP) dominated the market in 2015. This was attributed to the small, lightweight, high performance semiconductor solution of Fan-in WLP.
However, Fan-out WLP is estimated to witness the higher growth rate in the market owing to its advances such as smaller form factor and thinner packaging with higher input/output (I/O) count along with improved thermal and electrical performance. In addition, it is a compelling, cost-effective solution for space constrained mobile applications and other portable consumer and industrial devices.
In bumping technology, copper bumping held over 50% in the year 2015 due to its exclusive advantages of low cost, compatibility with bond pads and applications in technologies such as transceivers, embedded processors, application processors, power management, and SOCs among others. Moreover, tin-lead eutectic solder is expected to witness a highly negative growth rate due to government initiatives to ban toxic substances that have high impact on the market.
Electronics industry contributed over 47% of the overall WLP market in the year 2015. Imminent need of size reduction in electronics devices, requirement of higher data transmission speed, and improvement in efficiency collectively fuel the replacement of conventional packaging with WLP in electronics industry, hence, making it dominant in the overall market.
However, IT & telecommunication would be the fastest growing segment and is expected to register highest CAGR 25.2% during the forecast period. This is due to the increase in reach of telecommunication services in remote areas as well as introduction of new players in IT industry where WLP is used in large scale-inside servers, host systems, and data centers.
Asia-Pacific dominated the market in 2015 by accounting over 50% of the total market revenue and it is expected to maintain its dominance throughout the forecast period. This is accredited to the presence of various manufacturing facilities, high consumption, and production of electronic products where WLP is steadily replacing wire bond and ongoing R&D.
Further, North America and Europe are the second and third leading regions in WLP market. These regions are expected to witness slow growth during the analysis period owing to mature electronics and IT & telecommunication industry.
Wafer Level Packaging MarketKey Findings:
- Fan-out WLP is estimated to witness the highest growth rate in the market owing to its technological advances such as smaller form factor and thinner packaging with higher input/output (I/O) count along with improved thermal and electrical performance.
- In 2015, copper pillar led the overall WLP market revenue, and is projected to grow at a CAGR of 22.4% during the forecast period.
- Tin-lead eutectic solder is expected to witness comparatively slow growth rate due to government initiatives to ban toxic substances that have impacted its market heavily.
- Electronics industry constituted significant share in the overall WLP market in 2015 due to imminent need of size reduction in electronics devices, requirement of higher data transmission speed, and improvement in efficiency.
- In integration type of WLP, fan-in WLP dominated the market in 2015 owing to small, lightweight, high performance semiconductor packaging solution. .
- Asia-Pacific dominated the market in 2015 by accounting over 50% of the total market revenue.
The key players in the wafer level packaging market are focused on expanding their business operations in the fast-growing emerging countries with new product launches through various R&D facilities. WLP manufacturing companies have been designing the most efficient packaging solutions for the electronic product manufacturers for electric vehicles, healthcare equipment, household storage and portable electronics to launch technologically advanced products in order to increase their market share.
The major players profiled in this report include Amkor Technology Inc., Fujitsu Ltd., Jiangsu Changjiang Electronics Technology Co. Ltd., Deca Technologies, Qualcomm Inc., Toshiba Corp., Tokyo Electron Ltd., Applied Materials, Inc., ASML Holding NV, and Lam Research Corp.
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