Materials & Chemicals Market Research News

New study: Global 3D semiconductor packaging market size is expected to garner $8.9 billion by 2022, growing at a CAGR of 15.7% from 2016 to 2022

Materials & Chemicals Research

The need to control the chip designing cost, which plays a major role in overall price of electronic devices; increase in demand for miniaturized circuits; and short replacement period of electronics products, which are constituted of integrated circuits manufactured with 3D packaging technology are the major factors that drive the growth in the 3D semiconductor packaging industry. However, high cost required to establish a 3D semiconductor packaging facility hinders the growth opportunities in 3D semiconductor packaging industry and this is anticipated to grow the overall 3D semiconductor packaging market size to three folds of the current value. On the contrary, the growth in trend of Internet of Things (IoT) and increase in number of wireless devices are opening new opportunities which will increase 3D semiconductor packaging market share in overall advanced packaging market.

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The report “3D Semiconductor Packaging Market by Technology (3D Through silicon via, 3D Package on Package, 3D Fan Out Based, 3D Wire Bonded, and Others), by Material (Organic Substrate, Bonding Wire, Leadframe, Encapsulation Resin, Ceramic Package, Die Attach Material, and Others), and Industry Vertical (Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace & Defense, and Others) - Global Opportunity Analysis and Industry Forecast, 2014-2022” available in Market Intel Reports estimates that 3D Semiconductor Packaging Market Is Influenced By High Demand for 3D Wire Bonding

Browse 228 Pages of recent research on “Global 3D Semiconductor Packaging Market” @ http://www.marketintelreports.com/report/allied0537/3d-semiconductor-packaging-market-by-technology-3d-through-silicon-via-3d-package-on-package-3d-fan-out-based-3d-wire-bonded-and-others-by-material-organic-substrate-bonding-wire-leadframe-encapsulation-resin-ceramic-package-die-attach-material-and-others-and-industry-vertical-electronics-industrial-automotive--transport-healthcare-it--telecommunication-aerospace--defense-and-others--global-opportunity-analysis-and-industry-forecast-20142022

The 3D Semiconductor Packaging Market produces 3D semiconductor packaging which makes the use of 3D schemes based on the conventional methods like the wire bonding for vertical stacks and flip chip interconnection. PoP configurations which are connected to the stack memory dies are also part of the market.

This advanced packaging technology in the 3D Semiconductor Packaging Market involves semiconductor chips in which to more layers of electric components are stacked and interconnected vertically and horizontally to function as one device. The 3D packaging has many advantages over the other technologies by having reduced space consumption, good performance, reduced power loss, and better efficiency.

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Scope & Regional Forecast of the 3D Semiconductor Packaging Market

The 3D Semiconductor Packaging Market is driven by the factor of increasing use of portable electronics. The demand for miniaturized circuits is expanding rapidly due to technological advancements and technical support.

The use of semiconductor packaging is useful for many manufacturers from many end use industries.

The 3D Semiconductor Packaging Market is influenced by the high demand for 3D wire bonding. The increasing use of flash memory devices is creating a demand for the 3D wire bonding in electronics due to its wide usage.

Flash memory is also being used in robotics which fuels the growth for 3D wire bonding.

The market for the semiconductor package is concentrated in North America, Europe, Asia Pacific, Latin America, Middle East, and Africa. The demand for the 3D semiconductor packaging is very high in Asia Pacific.

A steady growth is expected in the regions of North America and Europe.

Get Sample Brochure of the report @ www.marketintelreports.com/pdfdown…php?id=allied0537

Segmentations & Key Players Involved in the 3D Semiconductor Packaging Market

The 3D Semiconductor Packaging Market can be broken down into various segmentations on the basis of –

  • Technology- 3D Through Silicon Via, 3D Package on Package, 3D Fan Out Based, 3D Wire Bonded, and Others (Flip Chip and Hybrid).
  • Material- Organic Substrate, Bonding Wire, Leadframe, Encapsulation Resins, Ceramic Packages, Die Attach Material, Others (Underfill Materials and Solder Balls).
  • Industrial vertical- Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace & Defense, Others (Media & Entertainment and Renewable Energy Resources).
  • Regions- North America, U.S., Canada, Mexico, Europe, UK, Germany, France, Italy, Rest of Europe.

Some of the key players involved in the 3D Semiconductor Packaging Market are as follows:

  • 3M Company
  • Advanced Semiconductor Engineering
  • Micron Technology
  • United Microelectronics
  • STATS ChipPAC

Access this Report @ www.marketintelreports.com/purchase.php?id=allied0537

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