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Learn details of the semiconductor packaging materials market to grow at 5.27% CAGR to 2021

Learn details of the semiconductor packaging materials market to grow at 5.27% CAGR to 2021

Semiconductor Packaging Materials market report considers the revenue generated by vendors through the sales of semiconductor packaging materials which are organic substrates, lead frames, bonding wires, encapsulation resins, die attach materials, solder balls, thermal interface materials, and WLP dielectrics.

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Commenting on the Semiconductor Packaging Materials Market report, an analyst the latest trend gaining momentum in the semiconductor packaging materials market is Increase in adoption of flip-chip, Sip, lead-free packaging solutions. To meet certain international standards of compliance, the lead-free packaging is gaining popularity and is set to continue during the forecast period.

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The analysts forecast global semiconductor packaging materials market to grow at a CAGR of 5.27% during the period 2017-2021.

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Semiconductor packages are plastic, ceramic, and metal components that are not only protect fabricated integrated circuits (ICs) on the semiconductor die, but also act as an interconnect between the printed circuit board (PCB) and the die during shipping and handling.

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Semiconductor packaging components vary in dimensions and functionality and are mainly organic substrates, bonding wires, encapsulation resins, lead frames, thermal interface materials, die attach materials, and solder balls.

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This report, Global Semiconductor Packaging Materials Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years.

The report also includes a discussion of the key vendors operating in this market.

Table of Contents

PART 01: Executive Summary

PART 02: Scope of the Report

PART 03: Research Methodology

PART 04: Introduction
Market Outline

PART 05: Market Landscape
Market Ecosystem
Market Characteristics
Market Segmentation Analysis

PART 06: Market Sizing
Market Definition
Market Sizing 2016
Market Size and Forecast 2016-2021

PART 07: Five Forces Analysis
Bargaining Power of Buyers
Bargaining Power of Suppliers
Threat of New Entrants
Threat of Substitutes
Threat of Rivalry
Market Condition

PART 08: Customer Landscape

PART 09: Market Segmentation by Material Type
Segmentation by Material Type
Organic Substrates - Market Size and Forecast 2016-2021
Lead Frames - Market Size and Forecast 2016-2021
Bonding Wires - Market Size and Forecast 2016-2021
Others - Market Size and Forecast 2016-2021
Market Opportunity by Type of Materials

PART 10: Regional Landscape
Geographical Segmentation
APAC - Market Size and Forecast 2016-2021
Americas - Market Size and Forecast 2016-2021
EMEA - Market Size and Forecast 2016-2021
Market Opportunity

PART 11: Decision Framework

PART 12: Drivers and Challenges
Market Drivers
Market Challenges

PART 13: Market Trends
Increase in Adoption of Flip-Chip, Sip, Lead-Free Packaging Solutions
Growing Preference of Smt (Surface Mount Technology) Over Older Through-Hole Technology and Surge in Popularity of Redistributed Chip Packaging
Surge in Adoption of Semiconductor Ics for Automobiles and Shift Toward Copper As Bonding Wire Material

PART 14: Vendor Landscape
Competitive Scenario

PART 15: Vendor Analysis
Vendors Covered
Vendor Classification
Market Positioning of Vendors
Amkor Technology
Dupont
Henkel
Honeywell
Kyocera
Toppan Printing

PART 16: Appendix
List of Abbreviations

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