Materials & Chemicals Market Research News

Thermal interface materials market to reach US$ 2.33 billion by 2021

Materials & Chemicals Research

The Thermal interface material market research computers segment was the largest application of TIMs in 2015. TIMs are used in computers to optimize the performance and reliability for smooth functioning. TIMs are commonly used for transferring the thermal conductivity from the CPU or GPU to the heat sink coolers. Computer components, such as CPUs, chip sets, graphics cards, and hard disk drives, are susceptible to failure in case of overheating.

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Thermal Interface Materials Market is projected to reach USD 2.33 billion by 2021, registering a CAGR of 11.2% between 2016 and 2021. Increasing demands from the consumer electronics industry is the major driver for the TIMs market.

The telecom industry is another major segment boosting the growth of TIMs, globally.

Premium Insights

1 Attractive Opportunity in the Thermal Interface Materials Market

2 Thermal Interface Materials Market, By Region

3 Thermal Interface Materials Market in Asia-Pacific

4 Thermal Interface Materials Market Attractiveness

5 Thermal Interface Materials Market: Developed vs Developing Nations

6 Life Cycle Analysis, By Region

Thermal interface material market are used for improving the heat flow in computers by filling any voids or irregularities between the heat sink and SSE base plate mounting surfaces.

The use of TIMs in computers is growing at a high rate because of the increased demand for cloud and supercomputing. The increased demand for super computing is driving the market of TIMs.

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Asia-Pacific is the largest market for TIMs globally, with China dominating the market in the region. This region is witnessing the highest growth rate, which is attributed to the rapid economic expansion currently undergoing in the region.

The demand for TIMs is highly dependent on the economic growth of a region. In addition, rapid industrial development in Asia-Pacific is vigorously driving the demand for TIMs in electronics, telecom, and other applications.

Key Target Audience:

  • Thermal interface materials manufacturers
  • TIMs traders
  • Distributors and suppliers
  • End-use market participants of different segments of TIMs
  • Government and research organizations
  • Associations and industrial bodies
  • Research and consulting firms
  • R&D institutions
  • Environment support agencies
  • Investment banks and private equity firms

This study has been validated through primary interviews with various industry experts globally. The break-up profile of primary discussion participants is given here Tier 1 (40%); Tier 2 (25%) and Tier 3 (35%) companies were contacted for interviews.

The interviews were conducted with various key people such as C level (30%), Researchers (40%), and Presidents (30%) from various key organizations. The primary interviews were conducted worldwide covering regions such as North America (45%), Europe (22%), Asia-Pacific (17%), and Row (16%).

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The report provides company profiles and competitive strategies adopted by the major market players such as Henkel Corporation (U.S.), Bergquist Company (U.S.), Indium Corporation (U.S.), Parker Chomerics (U.S.), Dow Corning (U.S.), Laird Technologies (U.S.), Momentive Performance Materials Inc. (U.S.), and Zalman Tech Co., Ltd.

(South Korea).

The report offers market estimations and projections till 2021 and offers a complete study of the market dynamics. In addition, the report provides the competitive landscape with major growth strategies adopted by the key players.

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