System in Package (SiP) Technology Market report, published by Allied Market Research, forecasts that the global market is expected to garner $30 billion by 2022, registering a CAGR of 9% during the period 2016 - 2022.Asia-Pacific dominates the global market in terms of revenue, accounting for more than 50% share of the global market, followed by North America.
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SiP Technology is widely used across the applications such as consumer electronics, telecommunication, and automotive. Presently, rise in demand for portable electronic devices and adoption of SiP in graphic cards and processors are some factors that majorly drive the market.
Moreover, increase in demand for high frequency electronic gadgets is expected to provide lucrative opportunities to market players. 2.5-D IC Packaging is the leading segment in the global SiP market, and is expected to maintain this trend throughout the forecast period.
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However, 3-D IC Packaging segment is expected to witness significant growth in the future, owing to the compact size and low power consumption.
Category: Market Research Publishers and RetailersCompany about: Allied Market Research is a global market research and business consulting wing of Allied Analytics LLP based in Portland, Oregon. Allied Market Research provides global enterprises as well as medium and small businesses with unmatched quality of “Market Research Reports” and “Business Intelligence Solutions”. AMR has a targeted view to provide business insights and consulting to assist its clients to make strategic business decisions and achieve sustainable growth in their respective market dom ...
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