The research study explains significant Impact of the COVID-19 on Package Substrates Market 2020-2026 dynamics like growth opportunities alongside the potential problems impacting the overall industry.
Since the COVID-19 virus outbreak in December 2019, the disease has spread to almost 100 countries around the globe with the World Health Organization declaring it a public health emergency. The global impacts of the coronavirus disease 2019 (COVID-19) are already starting to be felt and will significantly affect the Package Substrate market in 2020.
COVID-19 can affect the global economy in three main ways: by directly affecting production and demand, by creating supply chain and market disruption, and by its financial impact on firms and financial markets.
The outbreak of COVID-19 has brought effects on many aspects, like flight cancellations; travel bans and quarantines; restaurants closed; all indoor events restricted; over forty countries state of emergency declared; massive slowing of the supply chain; stock market volatility; falling business confidence, growing panic among the population, and uncertainty about future.
This report also analyses the impact of Coronavirus COVID-19 on the Package Substrate industry.
NOTE: Our reports include the analysis of the impact of COVID-19 on this industry. Our new sample is updated which correspond in new report showing impact of Covid-19 on Market trends, growth, economic slowdown, opportunities and COVID-19 impact on the overall Industry.
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The package substrate is directly used to carry the chip, which not only provides support, protection and heat dissipation for the chip, but also provides electronic connection between the chip and the PCB motherboard.
Based on our recent survey, we have several different scenarios about the Package Substrate YoY growth rate for 2020. The probable scenario is expected to grow by a -6.9% in 2020 and the revenue will be US$7.4 billion in 2020 from US$ 7.96 billion in 2019.
The market size of Package Substrate will reach US$ xx in 2026, with a CAGR of xx% from 2020 to 2026.
According to Prismark data, the global packaging substrate market bottomed out in 2017, and it is expected that by 2022, it will reach a compound growth rate of 2.9% to reach US $ 7.74 billion. Different from the low growth rate of the global market, the output value of mainland China's packaging substrates has increased year by year after 2012, reaching US$ 1.29 billion in 2017 (mainland output value, including domestic and oreign capital, global share of 20%).
estimated 2018-2022 The annual output value of mainland packaging substrates will maintain a compound growth of more than 12%, and the industry transfer trend is obvious.
The packaging process can be divided into the steps of wafer cutting, wafer bonding, gold wire bonding, plastic packaging, laser printing, cutting and bending, inspection and testing.
According to different substrate materials, package substrates can be divided into BT and ABF.
The BT substrate can avoid leakage current and popcorn phenomenon (impacted by moisture and high temperature) in semiconductor packaging testing.
The ABF material can meet the requirements of fine lines and small line widths in line with advanced semiconductor manufacturing processes. It is suitable for ICs with high pin count and high transmission.
It is mostly used in PC products such as graphics chips, processors, and chipsets.
It accounts for about 70% of the global packaging substrate market. Although ABF has great potential, the use of ABF materials requires a large amount of equipment investment, a long customer certification cycle, and a high barrier to entry.
At present, semiconductor packaging is in the third stage of maturity and rapid growth, and it has entered the stage of large-scale production with major packaging forms such as BGA / CSP. At the same time, the fourth technological change with SiP and MCM as the main development direction is at the stage of incubation.
Package substrate products are diversified. From the perspective of output value distribution, in 2019, package substrates mainly include FCBGA / PGA / LGA, FCCSP, FCBOC and WBPBGA, WB CSP, RF & DigitalModule as the six main products in the package substrate market.
Among them, FCBGA / PGA / LGA has a share of approximately 41% at most, and RF & DigitalModule has a minimum of approximately 13%.
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The world's top ten packaging substrate manufacturers account for more than 80% of the market share, and the industry presents an oligopoly pattern. The top three global companies UMTC, Ibiden, and SEMCO are from Taiwan, Japan, and South Korea, respectively, accounting for 14.78%, 11.19%, and 9.9% of the global market
From the point of view of production, global carrier boards are mainly manufacturers in Taiwan (31%), Japan (20%), and South Korea (28%), accounting for about 80% of the global share.
The package substrate serves as a carrier for chips, and its downstream requirements are highly related to IC chips. The packaging substrate is an important branch of the PCB board, which belongs to the high-end market segment, with high density, high precision, miniaturization and thinness.
It covers various social and economic fields such as communications, industrial medical, aerospace, automotive electronics, and computers. The explosion of related science and technology represented by 5G and the Internet of Things will promote the rapid development of the entire semiconductor industry chain.
Among them, the most important downstream market belongs to the field of communication. In the field of communication equipment and mobile terminals, the demand for packaging substrates accounts for 8.95% and 26.36% of its total PCB demand, respectively.
This report presents the worldwide Package Substrates market size (value, production and consumption), splits the breakdown (data status 2014-2019 and forecast to 2025), by manufacturers, region, type and application.
This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.
The following manufacturers are covered in this report:
Shinko Electric Industries
Nan Ya PCB
Zhen Ding Technology
Shenzhen Fastprint Circuit Tech
Package Substrates Breakdown Data by Type
Package Substrates Breakdown Data by Application
Package Substrates Production by Region
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Package Substrates Consumption by Region
Rest of Europe
Central & South America
Rest of South America
Middle East & Africa
Rest of Middle East & Africa
The study objectives are:
To analyze and research the global Package Substrates status and future forecast，involving, production, revenue, consumption, historical and forecast.
To present the key Package Substrates manufacturers, production, revenue, market share, and recent development.
To split the breakdown data by regions, type, manufacturers and applications.
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions.
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
In this study, the years considered to estimate the market size of Package Substrates :
History Year: 2014 - 2018
Base Year: 2018
Estimated Year: 2019
Forecast Year: 2019 - 2025
This report includes the estimation of market size for value (million USD) and volume (K sqm). Both top-down and bottom-up approaches have been used to estimate and validate the market size of Package Substrates market, to estimate the size of various other dependent submarkets in the overall market.
Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified primary sources.
For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.
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